Visionics.EDWinXP.v1.70印刷电路板设计制造工具包

    Visionics.EDWinXP.v1.70印刷电路板设计制造工具包 
EDWin和EED III是整合型的CAD/CAE软件包，EDWinXP则是包含3D的预览功能、各种3D编辑功能，也可以编辑VHDL源码的文件，亦可转换成CUPL、JEDEC、XILINX等格式，建立模型等等的3D模型功能。 
The price-performance leader is now packed with enhanced features - faster loading time for

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■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□■□EDSpice Simulator and 3D Board view, Thermal and Electromagnetic Analyzers have been grouped under Board Analyzers, customizable component browser in Layout and Schematic Editor introduced. In order to avoid confusion between nodes and connections a common tool connection has been introduced.