全部博文（436）
分类： LINUX
2012-12-10 19:45:00
第三节最常提到的就是minimizes shared-resource contention 减小分享资源的论点
There have been three distinct branches of research on the issue of shared resource contention in CMPs in the context of power/energy scheduling.
有三个不同的分支研究问题上的共享资源的争夺（参考翻译）
第四节 主要讲 温度对操作的影响，在温度过高时计算机会自动降低频率和电压，防止温度过高，对硬件的损害，这是一种反应技术。Computer chips like any other manufactured good have a temperature range within which they were designed to operate.
计算机芯片有一个温度范围，在范围内他们被设计操作，当超出范围就会损坏芯片，导致停止工作。介绍了静态技术和动态技术
解决的办法就是“热管理Temperature gradients”
Temperature gradients can be created in both space and time; 温度梯度被创建于空间和时间；
they will stress the underlying materials and dramatically decrease the expected lifespan of the device
Dynamic techniques are further divided into those that use temperature measurements directly available from on-chip sensors and those that construct thermal models to predict future temperature data in order to make policy decisions. We conclude the section with a discussion
动态技术进一步划分为那些使用温度直接测量可从片传感器和热模型构建预测未来的温度数据，以便制定政策决定。
We conclude the section with a discussion of how different thermal management strategies can be integrated in order to provide more robust solutions.
我们的结论部分讨论如何不同的热管理策略可以为了提供更强大的解决方案。
4.1 Static Thermal Management静态热管理
One subset of proactive thermal-aware scheduling algorithms relies on static scheduling to meet predefined thermal goals.
一个子集，主动thermal-aware调度算法依靠静态调度预定义热目标。
Chantem et al. [49] use mixed integer linear programming(MILP) to decide on a mapping of tasks to a floorplan of cores as well as an ordering of tasks on each core such that all precedence and timing constraints are met while the preset max temperature is not exceeded.
chantem等人使用混合整数线性规划（混合整数线性规划）设计一个映射到一个任务平面磁芯以及预设任务的每一个核心的所有优先和时间，限制是在预设的任务不超过最高温度。
问题：1、红字标出为不理解的句子。
they will stress the underlying materials and dramatically decrease the expected lifespan of the device
其中stress 怎么理解
2、文中经常提到thread 翻译为 线程 具体什么意思？
