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2009-05-11 16:05:01

2009/01
中国WLAN 自主规范WAPI 蓄势待发 中文新闻中心
海华科技率先推出WAPI Module IC 抢得市场先机

(我在网上溜达了两天就找到这么点资料,可怜,可叹,可恨,你说考虑到经济和安全的因素制定了新的协议,把国外的竞争者拒之于国门之外这可以谅解,你说对内你还搞专利垄断,你看人家的datasheet,你看人家的源码开放度,这是来的哪门子买卖?这分明就是你可以用,但不能做,想做先加入那几个大企业再说。学习吗?学个屁。)

无 线通讯模块IC领导厂商海华科技,今天于中国北京召开记者会,宣布全球第一款支持中国WLAN 自主规范WAPI 之手持终端产品专用模块IC (module IC) 正式上市。 海华科技推出全系列WAPI解决方案,包括WAPI +Wi-Fi module IC 及WAPI +Wi-Fi+ 蓝芽 多功能 module IC,不仅具备安全、高速之传输功能,并可配合CDMA、GSM、3G等不同规格手机之应用。海华科技认为,透过手机上网的使用习惯已经在中国成形,但在 传输速度,安全性以及成本上仍有改善空间,WAPI为中国力推之自主规范,因此海华率先投入研发WAPI无线模块,提供更高速,更安全,更经济的手机上网 解决方案。

海华科技营销业务处处长王明德指出,随着中国大力布建无线城市,电信运营商积极发展WLAN技术及其增值服务,中国市场上无线通讯应用正从PC 快速扩展至手持终端。「支持WAPI的模块IC,可大幅缩减手持终端开发时程、降低开发成本,可为系统厂商快速打开WAPI手持终端的应用市场。」

海 华科技的WAPI手机无线模块IC,传输速度是现行GPRS或3G上网速度的数倍以上。WAPI标准强调的网络安全加密技术,具备可控性与管理性,可以改 善信息遭窃,非法入侵等问题,解决安全疑虑。为了符合手机轻薄小巧的设计要求,海华科技采用先进的半导体微型化设计及IC封装技术,模块尺寸仅有 9.6mm x 9.6mm,并具备高可靠度,高散热性等特点。同时,搭配完整的软件支持,可符合各种手机系统,有效为手机厂商缩短产品开发时程。海华科技营销业务处处长 王明德指出,中国市场的消费者对于使用手机上网,具有高度需求,系统厂商必须快速推出多样化的手机满足市场需求,无线模块IC将是最佳方案。

在 中国网通技术发展上,有线网络、无线局域网络(WLAN)以及3G将成为中国最广泛的基础宽带网络,而在中国移动、中国电信和新联通等电信运营企业标准 中,已经明确要求WLAN设备必须支持WAPI功能。根据中国WAPI产业联盟表示,包括Marvell、Broadcom、Atheros 都正积极研发支持WAPI之芯片,预计2009年将有更多WAPI芯片在中国上市。

我有一份aw-gh320的datasheet 地址

http://blogimg.chinaunix.net/blog/upfile2/090511183420.pdf

aw-381的介绍

feature:

Supports SDIO, G-SPI interfaces
  High speed UART,PCM/Inter-IC Sound(I2S), and SDIO
   for Bluetooth
Audio Codec interface support
Cellular phone co-existence support
  Multiple power saving modes for low power consumption
Quality of Service (QoS) support for multimedia
   applications
  Multi OS support including WinCE, Linux, u-Itron, ThreadX
Advanced security with WEP/WPA/WPA2/ IEEE 802.11i

The AW-GH381 is a IEEE 802.11 b/g Wireless LAN & Bluetooth Module IC;

支持wlan和Wireless PAN plan ieee802.15.1

it’s targeted to mobile devices including Mobile Phones, Digital Still Cameras (DSCs), Portable Media Players (PMPs), Personal Digital Assistants (PDAs), and Gaming Devices which need small footprint package, low power consumption, multiple interfaces and OS support. By using AW-GH381, the customers can easily enable the Wi-Fi and BT embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Compliance with the IEEE 802.11b/g standard, the AW-GH381 uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-GH381. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption, the AW-GH381 also supports the IEEE 802.11i security standard through the implementation of Advanced Encryption Standard (AES)/Counter Mode CBC-MAC Protocol (CCMP), and WEP with TKIP security mechanisms. The AW-GH381 also supports IPSec with DES/3DES/ASE encryption and MD5/SHA-1 authentication.

For the video, voice and multimedia applications the AW-GH381 support 802.11e Quality of Service (QoS).

For Bluetooth operation, the AW-GH381 is Bluetooth 2.0+Enhanced Data Rate (EDR) compliant. In addition, the AW-GH381 also supports Bluetooth 2.1 features.

The AW-GH381 supports SDIO and G-SPI for WLAN to the host processor. High speed UART,PCM/Inter-IC Sound(I2S), and SDIO interface are available to connect the BT core the host processor. AW-GH381 is suitable for multiple mobile processors for different applications. With the support cellular phone co-existence, the AW-GH381 is also the best solution for mobile phones and PDA phones applications.

AW-GH381 module adopts the leading-edge highly-integrated WLAN SoC. All the other components are implemented by all means to reach the mechanical specification required. AW-GH381 uses IC module integration package technology that provides customers mounting mechanism to secure the AW-GH381 module against vibration and shock on the host system. AW-GH381 uses module IC integration package technology can provide more reliable and strong electrical and mechanical performance.

AG-GH380英文介绍
feature: 
Supports SDIO, G-SPI interfaces
  Supports Bluetooth and Cellular phone co-existence
  Multiple power saving modes for low power consumption
Quality of Service (QoS) support for multimedia     applications
Multi OS support including WinCE, Linux, u-Itron, ThreadX
Advanced security with WEP/WPA/WPA2/ IEEE 802.11i

The AW-GH320 is a IEEE 802.11b/g wireless module IC

只支持wlan。

; it’s targeted to mobile devices including Mobile Phones, Digital Still Cameras (DSCs), Portable Media Players (PMPs), Personal Digital Assistants (PDAs), and Gaming Devices which need small footprint package, low power consumption, multiple interfaces and OS support. By using AW-GH320, the customers can easily enable the Wi-Fi embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Complian ce with the IEEE 802.11b/g standard, the AW-GH320 uses Direct Sequence Spread Spectrum ( DSSS ), Orthogonal Frequency Division Multiplexing ( OFDM ), DBPSK , DQPSK , CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-GH320. In addition to the support of WPA /WPA2 and WEP 64-bit and 128-bit encryption, the AW-GH320 also supports the IEEE 802.11i security standard through the implementation of AES-CCMP. The support of QoS also enables the AW-GH320 for the use of video, voice and multimedia applications.

The AW-GH320 provides host interfaces SDIO and G- SPI which are suitable for multiple mobile processors for different applications. With the support of Bluetooth co-existence and cellular phone co-existence, the AW-GH320 is also the best solution for mobile phones and PDA phones applications.

AW-GH320 module adopts the leading-edge highly-integrated WLAN SoC. All the other components are implemented by all means to reach the mechanical specification required.

AW-GH320 uses surface mount technologies (SMT) that solder join and soldering strength provide mounting mechanism to secure the AW-GH320 module against vibration and shock on the host system.

AW-GM270S/U介绍

feature:

48-pin module with 20mm(L) x 20mm(W) x 2.75 mm(H)
  dimension (with shielding)
  Supports SDIO(GM270S), USB(GM270U) interface
   support
Supports Bluetooth and Cellular phone co-existence
Quality of Service (QoS) support for multimedia
  applications
  Multi OS support including WinCE, Linux
Advanced security with WEP/ WAP/WAP2/ IEEE 802.11i

  The AW-GM270S/U is a IEEE 802.11b/g wireless module IC; it’s targeted to mobile devices including Digital Still Cameras (DSCs), Portable Media Players (PMPs), Personal Digital Assistants (PDAs), and Gaming Devices which need small footprint package, low power consumption, multiple interfaces and OS support. By using AW-GM270S/U, the customers can easily enable the Wi-Fi embedded applications with the benefits of high design flexibility, short development cycle, and quick time-to-market.

Compliance with the IEEE 802.11b/g standard, the AW-GM270S/U uses Direct Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and QAM baseband modulation technologies. A high level of integration and full implementation of the power management functions specified in the IEEE 802.11 standard minimize the system power requirements by using AW-GM270S/U. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption, the AW-GM270S/U also supports the IEEE 802.11i security standard through the implementation of AES-CCMP. The support of QoS also enables the AW-GM270S/U for the use of video, voice and multimedia applications.

The AW-GM270S/U provides host interfaces SDIO (GM270S) or USB (GM270U) which are suitable for multiple mobile processors for different applications. With the support of Bluetooth co-existence and cellular phone co-existence, the AW-GM270S/U is also the best solution for mobile phones and PDA phones applications.

AW-GM270S/U module adopts Realtek’s latest highly-integrated WLAN SoC---RTL8711S/U. All the other components are implemented by all means to reach the mechanical specification required.

AW-GM270S/U uses surface mount technologies (SMT) that solder join and soldering strength provide mounting mechanism to secure the AW-GM270S/U module against vibration and shock on the host system.
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